HomeAetina Nvidia SolutionsEdge AI SolutionAI Inference/Device EdgeJetson SeriesAX720-X32/X64

AX720-X32/X64

• Powered by NVIDIA Jetson AGX Xavier™
• Additional driver to support peripheral modules for I/O expansion capability
• On-board 2x HDMI, 1x M.2 M Key, 1x M.2 E Key and 3x RJ45
• Extended temperature range -25°C to 80°C
• 60-pins extension slot for fast bus speed
• Suitable for general robotics, UAV, AOI and deep learning

Overview

AX720-X32/X64 is a multiple-function supported embedded platform, based on NVIDIA® Jetson AGX Xavier™. With 120-pin MIPI CSI-II connector and fast bus speed, this edge computing platform can capture high-resolution image and transmit the inference results to server or cloud through high speed Ethernet. These two benefits not only increase the inference accuracy and precision but also reduce the latency time between edge and cloud.

AX720-X32/X64 fully supports M.2 device and extension 10G LAN module, developers can easily integrate the peripherals by its extension slots for any kinds of applications. Otherwise, through our offered driver-ready MIPI camera modules and certified peripheral I/O modules, that assist developers expand their systems’ I/O connectivity and VID(Video-Image-Detection) deployment flexibly and quickly.

AX720-X32/X64 is designed in small-form factor and support extended temperature range from -20°C to 80°C to meet challenging environments and space-constrained systems. AX720-X32/X64 helps to develop high resolution demand VID applications in robotics, AOI, warehouse logistics, inspection, healthcare, retail and intelligent systems at the edge.

● Fast bus speed for M.2 device and 10G LAN module
AX720-X32/X64 is designed with fast bus speed for M.2 device and 10G LAN. Through our extension I/O connector, developers can quickly and flexibly build systems’ I/O connectivity and communication without any time wasting and focus on software or algorithm developing.
● Designed for various embedded applications with extended temperature support
AX720-X32/X64 is designed in compact and small form factor with solid components used, ensures its high-quality data transferring even at wide temperature ranging from -25°C to 80°C. This make it ideally suitable for space-constrained embedded applications in challenging environments.